Reliability of Microsystems

For the system reliability of electronics, microsystems and technical equipment, the "Reliability of Electronic Microsystems" group at Fraunhofer IKTS offers:

• numerical simulations for layout and packaging design,
• material characterizations of individual and composite materials for packaging and interconnection technology (AVT),
• reliability assessments under accelerated and field loading condition,
• in-situ measurements of loadings and stresses and
• non-destructive testing techniques (NDT) for physics of failure analysis.

 

When designing assemblies with system reliability in mind, we focus on

• the measurement, calculation and analysis of applied loads and 
• their influence on the system design.