Since 1992, the core competence of the Thick-Film Technology working group has been the development and characterization of functional special pastes and inks (conductor, resistor and covering pastes, pastes for heater and sensor applications). In addition to the development of materials for classic screen or stencil printing, the group is increasingly focusing on functional printing applications, i.e. the intelligent functionalization of additively manufactured 3D components. Digital printing technologies, such as dispensing, dispense-jet as well as ink-jet and aerosol-jet® printing, which are well-established in the institute, are used for this purpose.
The development team of chemists and materials scientists cooperates closely with the neighboring groups of the Hybrid Microsystems department in order to be able to handle all tasks for our customers along the value chain, from the material to the component.