FEM-supported design of electronics for product reliability

Topic

FEM-based design.
© Fraunhofer IKTS
FEM-based design.

To evaluate the reliability of an assembly, it has become increasingly efficient to perform not only experimental tests for failure analysis and determination of failure physics, but also numerical simulations. Structural mechanics simulations based on finite element (FE) models offer a significant advantage for understanding structural behavior as they provide access to the stress and strain fields in the test geometry. In addition, the virtual environment enables reliability predictions based on the calculation results and the evaluation of large design spaces in a very short time. Fraunhofer IKTS has specialized in the design of electronics in this area and has extensive experience in the following simulation fields:

  • Analysis of heat dissipation/cooling and heat propagation
  • Evaluation of thermo-mechanical issues (low-cycle fatigue)
  • Evaluation of vibration behavior (high-cycle fatigue)

We place particular emphasis on mapping the condition of the objects of analysis as realistically as possible. This includes both the material characterization on the product-compliant test specimen and the mapping of the manufacturing process in the simulation.

 

Topic

Thermal simulation

 

Topic

Thermo-mechanical simulation

 

Topic

Simulation of vibration stresses