Fraunhofer Institute for Ceramic Technologies and Systems IKTS
Center for micro processes "Microsystems, LTCC and HTCC"
- Punching:
- Lasering- and Alignment marks
- Vias
- Lasering (wavelength at 355 nm and 1064 nm)
- Lasering of structures like channels, chambers, cavities
- Production of complex sensor designs, i.e. to avoid mechanical or thermal stresses
- Combined punching & lasering:
- Flexible and fast structuring
- Micromilling and -punching