Fraunhofer Institute for Ceramic Technologies and Systems IKTSAssembly of discrete components (SMD) with state of the art technologies:
- Wire bonding,
- Reflow soldering,
- Silver sintering,
- Adhesives,
- Direct writing (see Aerosol-printing)
Separating:
- Wafer dice
- Laser
- Polishing
- Thinfilm compatible surfaces (Ra < 50 nm)
Characterization & Verification:
- Visual Inspection
- Surface measurement
- Non-destructive testing
- Ultrasonic-microscopy
- computer tomography
- X-ray
Thermo-cycling and thermal tests
- Short- and long term
- Humidity-Heat-tests
Avalanche voltage measurement
Isolation tests