Fraunhofer Institute for Ceramic Technologies and Systems IKTSThe LTCC-Technology is an innovative platform for the packaging of integrated circuits and MEMS. Due to the excellent adaption of the thermal expansion coefficient between silicon and the glass-ceramic LTCC, this technology allows to realize robust and high reliable packages. Novel technologies, like direct writing technique for chip contacting or advanced packaging solutions for MEMS, increase the reliability of the component and reduce the consumption of space.
Furthermore complete microsystems based on LTCC-technology can be assembled.