Fraunhofer Institute for Ceramic Technologies and Systems IKTS
LTCC package for a wire bonded 3D MEMS acceleration sensor (in cooperation with Fraunhofer EMI)
Wire-bonded MEMS in SMD-package made of LTCC (in cooperation with Fraunhofer EMI)
Micro-Electro-Mechanical Systems (MEMS) are miniaturized microsystems with mechanically and electrically active components. They are manufactured mainly with the technologies of the semiconductor manufacturing and have structural sizes of lower micrometer range down to nanometers. Typical examples are inertial sensors, actuators, optical or microfluidic systems like print heads. MEMS need a platform in the shape of a housing which has to comply, depending on the type of the MEMS, to different requirements. The LTCC/HTCC technology allows such packaging solutions:
- Hermetic sealing of MEMS with ceramic,
- Integration of passive electrical components and conductor tracks for MEMS contacting,
- Media supply of liquids and gases by integrated channels and cavities in LTCC for sensors or cooling,
- Packaging of optically active MEMS (MOEMS) by integrating optical windows and fiber optic cables in LTCC and
- Integration of passive electrical components and conductor tracks for MEMS contacting (Future Packages).
The picture above shows the development solution of Fraunhofer IKTS for the hermetic packaging of an acceleration sensor.
Technical characteristics:
- size (5.75 x 4 x 1.75) mm,
- hermetic sealing of the MEMS,
- vertical positioning of the component and
- SMD design for integration into standard electronic applications.
Services offered:
- Development of packaging solutions for CMOS, MEMS, MOEMS components,
- Electrical and thermal investigations.