Optical Packaging

Multifunctional system platforms based on multilayer ceramic substrates, which are already established in the electronics manufacturing for hybrid, reliable and adjusted electronic assemblies for special working conditions could address the low and middle power range for laser-optical devices. Due to the excellent mechanical and thermomechanical properties of the used multilayer ceramic materials as well as the possibility for 3D structuring and integration of wiring and passive components in the ceramic platforms. The potential multiple panel manufacturing additionally enables the parallel and cost-efficient processing during the platform manufacturing as well as during the hybrid integration of more components.