3D profilometry and digital microscopy for analyzing electronic microsystems

The high demands placed on electronic assemblies, such as cost reduction, minimization of installation space or high reliability, require reproducible processes. Optical inspection is still an important tool for checking or analyzing errors. It is primarily used to monitor the correct implementation of joining and assembly processes. Our "Reliability of electronic microsystems" working group uses 3D digital microscopy and profilometry for this purpose.

3D digital microscopy

• Rapid observation of printed circuit boards and microsection samples using an automated xy-table
• In-house production of metallurgical microsections
• High depth of field thanks to automatic z-focusing
• Magnification: 5 to 5000
• Bright field, dark field, polarizing filter
• Illumination in incident light, transmitted light, ring light or combined
• Geometry measurement in 2D and 3D data

3D profilometry

• Semi-automated measurement of geometric deviations
• Measurement of warping of printed circuit boards etc.
• xy-resolution: 500 nm
• z-resolution: 100 nm
• Measuring range: 206 x 104 mm²
• Measuring accuracy: 2-2.5 µm